Advantech, a leading provider of edge computing and edge AI solutions, is pleased to announce their high-performance server and network appliances are now powered by the latest AMD EPYC Embedded 9005 Series processors. By leveraging these cutting-edge platforms, Advantech is driving edge computing and AI to new heights—making solutions ideal for 5G edge cloud, AI, machine learning, and enhanced data security.

"We are excited about the launch of Advantech's latest generation of innovative edge computing and AI solutions powered by AMD EPYC Embedded 9005 Series processors," said Amey Deosthali, Senior Director of embedded core markets at AMD. "Optimized for embedded markets, EPYC Embedded 9005 provides exceptional compute performance for edge AI applications while delivering enhanced IO capabilities, product longevity, and system resiliency."

AMD today launched the EPYC Embedded 9005 line of server processors in the embedded form-factor. These are non-socketed variants of the EPYC 9005 "Turin" server processors. The chips are intended for servers and other enterprise applications where processor replacements or upgradability are not a consideration. The EPYC Embedded 9005 "Turin" are otherwise every bit similar to the regular socketed EPYC 9005 series. These chips are based on a BGA version of the "Turin" chiplet-based processor, and powered by the "Zen 5" microarchitecture. Besides the BGA package, the EPYC Embedded 9005 series comes with a few features relevant to its form-factor and target use-cases.

To begin with, the EPYC Embedded 9005 "Turin" series comes with NTB (non-transparent bridging), a technology that enables high-performance data transfer between two processor packages across different memory domains. NTB doesn't use Infinity Fabric or even CXL, but a regular PCI-Express 5.0 x16 connection. It isn't intended to provide cache coherence, but to absorb faults across various memory domains. Next up, the series supports DRAM flush for enhanced power-loss mitigation. Upon detecting a power loss, the processor immediately dumps memory onto NVMe storage, before the machine turns off. On restart, the BIOS copies this memory dump from the NVMe SSD back to DRAM. Thirdly, the processors in the series support dual SPI flash interfaces, which enables system architects to embed lightweight operating systems directly onto a 64 MB SPI flash ROM, besides the primary SPI flash that stores the system BIOS. This lightweight OS can act like a bootloader for operating systems in other local storage devices.

Last Friday, AMD confirmed finalized price points for its upcoming Ryzen 9 9950X3D ($699) and 9900X3D ($599) gaming processors—both launching on March 12. Media outlets are very likely finalizing their evaluations of review silicon; official embargoes are due for lifting tomorrow (March 11). By Team Red decree, a drip feed of pre-launch information was restricted to teasers, a loose March launch window, and an unveiling of basic specifications (at CES 2025). A trickle of mid-January to early March leaks have painted an incomplete picture of performance expectations for the 3D V-Cache-equipped 16 and 12-core parts. A fresh NDA-busting disclosure has arrived online, courtesy of an alleged Ryzen 9 9950X3D sample's set of benchmark scores.

A pre-release candidate posted single and multi-thread ratings of 4739 and 69,701 (respectively), upon completion of PassMark tests. Based on this information, a comparison chart was assembled—pitching the Ryzen 9 9950X3D against its direct predecessor (7950X3D), a Zen 5 relative (9950X), and competition from Intel (Core Ultra 9 285K). AMD's brand-new 16-core flagship managed to outpace the previous-gen Ryzen 9 7950X3D by ~14% in single thread stakes, and roughly 11% in multithreaded scenarios. Test system build details and settings were not mentioned with this leak—we expect to absorb a more complete picture tomorrow, upon publication of widespread reviews. The sampled Ryzen 9 9950X3D CPU surpassed its 9950X sibling by ~5% with its multi-thread result, both processors are just about equal in terms of single-core performance. The Intel Core Ultra 9 285K CPU posted the highest single-core result within the comparison—5078 points—exceeding the 9950X3D's tally by about 7%. The latter pulls ahead by ~3% in terms of recorded multi-thread performance. Keep an eye on TechPowerUp's review section; where W1zzard will be delivering his verdict(s) imminently.

Earlier today, AMD confirmed finalized price points and a launch date for its two incoming additions to the Ryzen 9000X3D processor lineup. The current Zen 5 processor population (with 3D V-Cache onboard) has a count of one—Team Red's reigning gaming champion: the eight-core Ryzen 7 9800X3D model. AMD's Senior Vice President and General Manager of Computing and Graphics was the first staffer to make an official announcement regarding definitive talking points. Jack Huynh stated (via a social media post): the world's best processor for gaming and content creation is almost here. Available starting March 12th. Ryzen 9 9950X3D—$699. Ryzen 9 9900X3D—$599. A huge thank you to our incredible community of gamers, creators, and innovators for your continued support. Together, we're shaping the future of gaming and content creation! Let's level up together!"

The sixteen-core Ryzen 9 9950X3D and twelve-core 9900X3D SKUs were officially unveiled at CES 2025, in early January. Since then, many leaks have emerged online—certain soothsayers were bang on with their predictions. Almost a month ago, speculative $699 and $599 price points were leaked. On two separate occasions, a—now confirmed—March 12 launch day was projected. AMD is expected to lift media embargoes on March 11; reviews of finalized silicon will finally reveal whether the two new players can beat their incumbent sibling in gaming performance benchmarks. As reported this afternoon, China's JD.com retail platform has opened its order book to customers—a limited quantity of Ryzen 9 9950X3D and 9900X3D units were made available for a short period of time.

AMD's Ryzen 9 9950X3D and 9900X3D processors are reportedly due to launch mid-way through next week (March 12)—this "unofficial" release date was revealed by JD.com listings. Yesterday's report focused on the popular Chinese e-commerce platform's apparent leaking of Team Red's mid-March schedule. Last month, a local tipster—Golden Pig Upgrade—also alluded to a possible March 12 rollout of 16 and 12-core 3D V-Cache-equipped Zen 5 chips. In a surprise move, JD has started selling Ryzen 9 9950X3D and 9900X3D units. Earlier today, ITHome spotted updated product pages—JD disclosed that it was prepping an earlier than expected sale: "limited time and limited quantity available at 20:00 (local time) on March 7."

Officially, AMD has only teased a loose March launch window for its latest Ryzen Niners. VideoCardz has kept track of the company's recent announcements, and opines that the Ryzen 9000X3D release strategy is strange one. Embargoes for reviewer and influencers are tipped for lifting on March 11, so JD's premature sale of Ryzen 9 9950X3D and 9900X3D processors clashes with this schedule. JD's unusual 20:00 release time was highlighted by VideoCardz; they reckon that the 22:00 hour is a more appropriate kick-off time. It is possible that the limited quantity/short period sale was a mislabeled promotion for pre-orders—something could be lost in translation (see primary screenshot below), but similar events were reported in recent history.

AMD has confirmed pricing and launch for its newest Ryzen 9000X3D series processors, with the flagship 9950X3D priced at approximately 5599 RMB and the 9900X3D at 4599 RMB, according to preliminary Chinese store JD listings. Both processors will hit retail channels on March 12, with review embargoes reportedly lifting one day prior, as noted by VideoCardz. The Ryzen 9 9950X3D delivers 16 Zen 5 cores with boost frequencies reaching 5.7 GHz and operates within a 170 W TDP envelope. Its unique feature is 144 MB of combined cache memory (L2, L3, and stacked 3D V-Cache).

The 9900X3D scales back to 12 cores with 5.5 GHz peak frequencies and 140 MB total cache while reducing power consumption to 120 W TDP. These processors represent AMD's implementation of vertical cache stacking technology on its 12+ core Zen 5 setup, completing its Q1 2025 desktop portfolio expansion following earlier standard Ryzen 9000 series launches and the eight-core Ryzen 7 9800X3D. The 3D V-Cache technology could help with many workloads, with gaming performance expected to show the most significant gains and productivity expected to follow. We have to wait for official reviews to bring further conclusions, but we hope to hear official confirmation on availability soon.

One of the main pillars that vendors of Arm-based processors often cite as a competitive advantage versus x86 processors is a keen focus on energy efficiency and predictability of performance. In the quest for higher efficiency and performance, Arm vendors have largely designed out the ability to operate on multiple threads concurrently—something that most enterprise-class CPUs have enabled for years under the technology description of "SMT"—which was also created in the name of enabling performance and efficiency benefits.

Arm vendors often claim that SMT brings security risks, creates performance unpredictability from shared resource contention and drives added cost and energy needed to implement SMT. Interestingly, Arm does support multi-threading in its Neoverse E1-class processor family for embedded uses such as automotive. Given these incongruities, this blog intends to provide a bit more clarity to help customers assess what attributes of performance and efficiency really bring them value for their critical workloads.

ASUS today announced ExpertCenter PN54, a high-performance Copilot+ mini PC powered by AMD Ryzen AI 300 Series processors and AMD Radeon graphics. ExpertCenter PN54 offers extensive connectivity, including WiFi 7 and Bluetooth 5.4, and is able to support up to four 4K displays. This mini PC enables retailers and business to maintain their competitive edge alike: it's well-equipped to handle data-intensive workloads, AI-enhanced applications, and edge data processing. PN54 boasts more I/O ports than other mini PCs, allowing retailers to connect to multiple devices for field deployment or in limited-space environments.

First Copilot+ mini PC by ASUS built on AMD architecture
At the heart of ExpertCenter PN54 is the latest AMD Ryzen AI 300 Series processor that delivers over 50% more on-chip memory for enhanced performance. Built on the cutting-edge AMD Zen 5 cores previously only available in desktop CPUs, this latest processor features eight cores of processing power and a 5 GHz boost frequency. And with the advanced AMD XDNA 2 NPU Architecture, ExpertCenter PN54 handles AI-powered content creation, code compilation, data analysis, meetings, and other tasks seamlessly.

Framework has finally introduced its next-generation Framework Laptop 13, now powered by the extremely potent Ryzen AI 300 "Strix Point" APUs. The product is already available for pre-order on Framework's website, with prices starting from $899 for the Do-It-Yourself variant, and $1,099 for the fully assembled variant. From the outside, the design of the product has been left mostly unchanged, which may appear somewhat disappointing at first, although an unaltered design likely indicates compatibility of components between the two laptops, which is undoubtedly one of the primary selling points for the Framework Laptop.

As mentioned, the biggest upgrade that the new Framework Laptop brings to the table is the new selection of processors, with the Ryzen AI 9 HX 370 APU sitting at the highest-end. Unsurprisingly, the Strix Point APUs allow for excellent performance improvements to both CPU and GPU side of things. With 12 cores (4 Zen 5 + 8 Zen 5c) and 24 threads, the highest-end Ryzen AI 9 HX 370 APU performs admirably well in benchmarks as well as real-life workloads. The Radeon 890M iGPU is among the fastest available on the market, trading blows with the Arc 140T iGPU in synthetic benchmarks. Of course, the 50 TOPS NPU allows for CoPilot functionality, for those who care. The Windows variant ships with a dedicated CoPilot key as well, while the DIY variant does not.

The AMD Ryzen 9 9950X3D processor will head to retail next month—a March 12 launch day is rumored—but a handful of folks seem to have early samples in their possession. Reviewers and online influencers have been tasked with evaluating pre-launch silicon, albeit under strict conditions; i.e. no leaking. Inevitably, NDA-shredding material has seeped out—yesterday, we reported on an alleged sample's ASUS Silicon Prediction rating. Following that, a Bulgarian system integrator/hardware retailer decided to upload Cinebench R23 and PCMark Time Spy results to Facebook. Evidence of this latest leak was scrubbed at the source, but VideoCardz preserved crucial details.

The publication noticed distinguishable QR and serial codes in PCbuild.bg's social media post; so tracing activities could sniff out points of origin. As expected, the leaked benchmark data points were compared to Ryzen 9 9950X and 7950X3D scores. The Ryzen 9 9950X3D sample recorded a score of 17,324 points in 3DMark Time Spy, as well as 2279 points (single-core) and 42,423 points (multi-core) in Cinebench R23. Notebookcheck observed that the pre-launch candidate came: "out ahead of the Ryzen 9 7950X3D in both counts, even if the gaming win is less than significant. Comparing the images of the benchmark results to our in-house testing and benchmark database shows the 9950X3D beating the 7950X3D by nearly 17% in Cinebench multicore." When compared to its non-3D V-Cache equivalent, the Ryzen 9 9950X3D leverages a slight performance advantage. A blurry shot of PCbuild.bg's HWiNFO session shows the leaked processor's core clock speeds; going up to 5.7 GHz (turbo) on a single CCD (non-X3D). The X3D-equipped portion seems capable of going up to 5.54 GHz.

Recent reports indicate that evaluation samples of AMD's Ryzen 9 9950X3D and 9900X3D processors have circulated to global press and influencer outlets. Leaks are expected to trickle out, going all the way up to a rumored March 11 lifting of review embargoes. Late last week, we reported on a double NDA-busting test system; utilizing Team Red's upcoming 16-core 3D V-Cache-equipped flagship gaming CPU, and a Radeon RX 9070 XT GPU. HXL (aka 9550pro) unearthed another example—their weekend sleuthing activities pointed to an alleged ASUS Silicon Prediction (SP) rating of 120. This tally was (reportedly) produced by a Ryzen 9 9950X3D sample unit. The predictive rating system sniffs out a candidate processor's quality and overclock potential.

An off-screen capture of an unidentified tester's UEFI BIOS session was posted to social media—the "MBEC-X870-0130" identifier points to a non-specific X870-based ASUS motherboard model. Leaked diagnostic information clearly shows a "Ryzen 9 9950X3D" processor (base clock 4.3 GHz) powering this particular test build. Its 120 ASUS SP score was cross-referenced with tallies shared by owners of Ryzen 7 9800X3D processors. As observed by VideoCardz, various examples of AMD's reigning gaming champion scored within the typical range of 113 to 118. The upcoming 16-core Ryzen 9 9950X3D and 12-core 9900X3D parts are predicted to offer only mild benefits (in gaming environs) over their 8-core sibling; so any sign of superiority will be celebrated as a victory.

MSI is pleased to announce support for the upcoming AMD Ryzen 9 9950X3D and 9900X3D processors, built on the Zen 5 architecture and featuring AMD's cutting-edge 2nd generation AMD 3D V-Cache technology. This innovative technology is designed to significantly increases the cache size, allowing faster data access and improved performance. Engineered to deliver exceptional performance, these processors meet the demands of even the most intensive gaming and content creation workloads.

At the heart of this experience is the MSI MEG X870E GODLIKE motherboard, which sets a new standard with its innovative design and robust features. The Dynamic Dashboard III, a 3.99-inch full-color LCD, offers real-time hardware monitoring, troubleshooting, BIOS update status, clock display, and personalization options, enhancing user experience and system control. MSI's EZ Link design complements this, streamlining cable management by consolidating the front panel, fan, and RGB headers into the EZ Bridge and EZ Control Hub, ensuring a cleaner build and simplified installation process.

We have noticed an uptick of AMD Ryzen 9 9950X3D and Ryzen 9 9900X3D-related leaks in mid-to-late February; suggesting an imminent launch. Officially, a Q1 release window was set by Team Red leadership during their CES 2025 presentation, and further disclosures pointed to a loose March window. Earlier today, Golden Pig Upgrade disclosed NDA-busting information—the veteran leaker believes that AMD will be lifting global Ryzen 9 9950X3D CPU review embargoes on March 11. VideoCardz jumped on this unofficial announcement, and reached out to industry insiders. The anonymous contacts reported back; they allege that a March 12 retail release is on the cards.

It is believed that the 16-core and 12-core X3D-equipped "Granite Ridge" Ryzen 9 desktop chips will roll out on the same day (March 12). Coincidentally, Golden Pig Upgrade reckons that Intel's Core Ultra 200HX "Arrow Lake" mobile processor series will launch alongside Team Red's high-end gaming duo. The latter two are touted to attract the majority of press attention on day one. As pointed out by VideoCardz, the release of Radeon RX 9070 GPUs is—speculatively—scheduled a week in advance of AMD's expansion of its Ryzen 9000X3D lineup. Early last week, price points were leaked—courtesy of accidental Newegg listings: $699.99 for the Ryzen 9 9950X3D, and $599.99 for the 12-core Ryzen 9 9900X3D.

AMD's "Strix Halo" APU, marketed as Ryzen AI Max+, has just been exposed in die-shot analysis. Confirming the processor's triple-die architecture, the package showcases a total silicon footprint of 441.72 mm² that integrates advanced CPU, GPU, and AI acceleration capabilities within a single package. The processor's architecture centers on two 67.07 mm² CPU CCDs, each housing eight Zen 5 cores with a dedicated 8 MB L2 cache. A substantial 307.58 mm² I/O complements these die that houses an RDNA 3.5-based integrated GPU featuring 40 CUs and AMD's XDNA 2 NPU. The memory subsystem demonstrates a 256-bit LPDDR5X interface capable of delivering 256 GB/s bandwidth, supported by 32 MB of strategically placed Last Level Cache to optimize data throughput.

The die shots reveal notable optimizations for mobile deployment, including shortened die-to-die interfaces that reduce the interconnect distance by 2 mm compared to desktop implementations. Some through-silicon via structures are present, which suggest potential compatibility with AMD's 3D V-Cache technology, though the company has not officially confirmed plans for such implementations. The I/O die integrates comprehensive connectivity options, including PCIe 4.0 x16 lanes and USB4 support, while also housing dedicated media engines with full AV1 codec support. Initial deployments of the Strix Halo APU will commence with the ASUS ROG Flow Z13 launch on February 25, marking the beginning of what AMD anticipates will be broad adoption across premium mobile computing platforms.

ASUS Republic of Gamers (ROG) announced that the 2025 ROG Flow Z13 is now available for pre-order. This versatile gaming 2-in-1 can feature up to AMD's newest AMD Ryzen AI Max+ 395 Processor with Radeon 8060S Graphics and a unified memory structure, allowing for incredible performance and power efficiency. A new stainless steel and copper vapor chamber, larger intake vents, and 2nd Gen Arc Flow Fans offer 70% more airflow for quiet and efficient cooling.

This 13-inch tablet boasts a stunning ROG Nebula Display, a 2.5K resolution 180 Hz touchscreen with 500 nits of peak brightness, and Corning Gorilla Glass 5 protection. The Flow Z13 now also features a larger 70Wh battery, a larger touchpad and keycaps, and a convenient Command Center button for quick access to vital system functions. With dual USB-C ports, both of which support USB4 and power delivery, as well as a dedicated HDMI 2.1 port, the Flow Z13 lets gamers leave their dongles at home.

Yesterday, the ASUS Chinese office announced a special event—on February 25—dedicated to launching a next-gen AMD APU-powered premium notebook model: "ROG Magic X (or Illusion X) is the first to be equipped with the Ryzen AI MAX+ three-in-one chip, which can efficiently coordinate multiple modes, provide combat power and computing power on demand, and can handle e-sports, creation and AI with one chip!" The manufacturer's Weibo post has generated plenty of buzz; industry insiders reckon that reviews could be published today (February 18)—HXL/9550pro informed VideoCardz with a not so cryptic message: "STX-Halo NDA: Feb 18th 2025."

Western press outlets point out that the ROG Magic X is a local variant of the familiar ROG Flow Z13 design; a 2025 refresh brings in AMD's much anticipated "Strix Halo" APU design. Team Red-authored marketing material and pre-release evaluation leaks have hinted about impressive integrated graphics solution performance; equalling or even exceeding that of previous-gen dGPUs. Well-known North American hardware review outlets have dropped hints (NDA permitting) about AMD's Ryzen Al Max+ 395 and Max 390 processors. Hardware Canucks could barely contain their excitement regarding the potent Zen 4 and RDNA 3.5 combo package; to the point of wish listing a potential direct successor: "Strix Halo is one of the most exciting things launched into the PC space in the last half decade. Full stop...AMD can't keep this as a one-off. If it's followed up with Zen 6 and RDNA 4 next year...watch out." Naturally, Team Red's cutting-edge mobile CPU technology is arriving in devices with high asking prices. The aforementioned ROG Flow Z13 2025 model—configured with top specs—is priced at $2699. Notebookcheck reckons that ASUS has tacked on an extra $500, since an announcement of initial pricing at CES 2025.

ASUS's Republic of Gamers China account on Weibo has teased the ROG Magic X mobile device that combines laptop/tablet form with a detachable keyboard. Inside, the device is powered by AMD Ryzen AI MAX+ SoC, which ASUS called a "three-in-one" chip, mainly due to its CPU, NPU, and iGPU combination. One possible SKU for ROG Magic X is AMD's top-end Ryzen AI MAX+ 395 processor. Carrying 16 "Zen 5" cores and 32 threads, the chip is designed for AI-enhanced laptops with 126 combined TOPS of AI processing power. The Ryzen AI MAX+ 395 features 64 MB of L3 cache and operates at a base clock of 3 GHz, with boost capabilities up to 5.1 GHz, depending on workload conditions. Manufactured on TSMC's 4 nm process node, the processor maintains a modest 55 W TDP, suitable for high-performance mobile systems. The chip includes support for ECC memory and PCIe Gen 5. It integrates the Radeon 8060S solution based on RDNA 3.5 architecture for graphics.

We are yet to see more details about the ROG Magic X, but with the arrival of AMD Ryzen AI MAX+, we assume this machine will result in a powerful gaming device for users on the go. More details are expected on February 25, when ASUS plans to showcase it. Pricing and availability are also expected to follow soon after.

Back in January, we covered a report about AMD designing its next-generation "Zen 6" CCDs on a 3 nm-class node by TSMC, and developing a new line of server and client I/O dies (cIOD and sIOD). The I/O die is a crucial piece of silicon that contains all the uncore components of the processor, including the memory controllers, the PCIe root complex, and Infinity Fabric interconnects to the CCDs and multi-socket connections. Back then it was reported that these new-generation I/O dies were being designed on the 4 nm silicon fabrication process, which was interpreted as being AMD's favorite 4 nm-class node, the TSMC N4P, on which the company builds everything from its current "Strix Point" mobile processors to the "Zen 5" CCDs. It turns out that AMD has other plans, and is exploring a 4 nm-class node by Samsung.

This node is very likely the Samsung 4LPP, also known as the SF4, which has been in mass-production since 2022. The table below shows how the SF4 compares with TSMC N4P and Intel 4, where it is shown striking a balance between the two. We have also added values for the TSMC N5 node from which the N4P is derived from, and you can see that the SF4 offers comparable transistor density to the N5, and is a significant improvement in transistor density over the TSMC N6, which AMD uses for its current generation of sIOD and cIOD. The new 4 nm node will allow AMD to reduce the TDP of the I/O die, implement a new power management solution, and more importantly, the need for a new I/O die is driven by the need for updated memory controllers that support higher DDR5 speeds and compatibility with new kinds of DIMMs, such as CUDIMMs, RDIMMs with RCDs, etc.

AMD's Ryzen 9000HX lineup of "Fire Range" Zen 5 mobile processors is due for release within a vague March to April window, with the upcoming 3D V-Cache-equipped Ryzen 9 9955HX3D SKU touted to become a top choice for manufacturers of ultra high-end gaming laptops. The latest version of CPU-Z is ready (in advance) with support for Team Red's incoming product line; CPUID's patch notes (published on February 8) have revealed previously unannounced models. AMD's official introduction of Ryzen 9000HX series CPUs included an opening salvo of Ryzen 9 9955HX3D (16-core), 9955HX (16-core) and 9850HX (12-core) models.

According to CPU-Z version 2.14, three additional "Fire Range" SKUs are seemingly on the way. Starting off with the Ryzen 9 9950HX3D—a (presumably) slightly less potent 3D V-Cache-sporting model—its nomenclature suggests that it will sit just below the series flagship. The 9950HX model is expected to slot just under the already announced 9955HX chip. The newly revealed 9845HX SKU could become the lowest 12-core offering within AMD's "Fire Range" product stack.

The AMD Ryzen 9 9950X3D and Ryzen 9 9900X3D "Zen 5" processors are due for launch at some point next month, but Team Red's recent-ish introductory presentation did not include any details regarding prices. Given patterns demonstrated by previous generations of Team Red's popular 3D V-Cache-equipped CPUs, we can safely assume that the incoming duo will demand a premium over the already released Ryzen 7 9800X3D SKU (MSRP: $479). Late last week, momomo_us happened upon speculated price points during a sleuthing session involving a comparison shopping website.

The PCPartPicker's price aggregation engine pulled data from two Newegg listings—now scrubbed from existence—that outlined a cost of $699.99 (plus a $12.41 shipping fee) for the 16-core Ryzen 9 9950X3D model, and $599.99 (plus shipping) for the 12-core Ryzen 9 9900X3D. Fortunately, VideoCardz preserved this information over the weekend. PCPartPicker has removed the aforementioned figures from its price history chart system, and Newegg has delisted the offending pages. The leaked price points align closely with MSRPs set for previous-gen (Zen 4) Ryzen 9 7000-series CPUs: $699 for the 7950X3D, and $599 for 7900X3D. The de-listed prices could be based on placeholder information—the Ryzen 7 9800X3D launched last November with a generational premium of $30 (Ryzen 7 7800X3D's original MSRP was $449). AMD has alluded to gaming performance being on a roughly even plane, so the incoming Ryzen 9 9950X3D and 9900X3D models are not expected to surpass the Ryzen 7 9800X3D as "THE best gaming processor."

One of AMD's key announcements at its 2025 International CES keynote was the Ryzen 9000HX line of processors, codenamed "Fire Range." A successor to the 7000HX "Dragon Range," this is essentially a BGA package of the "Granite Ridge" MCM, which combines one or two "Zen 5" CCDs with a client I/O die. The processor lacks an NPU and has a basic iGPU, but is meant for enthusiast segment gaming notebooks and portable workstations, as it's meant to be paired with discrete GPUs, taking advantage of the package's lavish 28 PCIe Gen 5 lanes. The Ryzen 9 9955HX3D stands out in the series as the only model with 3D V-Cache, making it possibly the fastest mobile processor for gaming notebooks—faster than even the "Arrow Lake-HX," given how the desktop 9800X3D compares to the Core Ultra 9 285K at gaming.

Notebook OEM Dream Machines put out a press release which specifies that the first notebooks powered by the 9955HX3D will ship either toward the end of March, or early-April 2025. "Fire Range" is known to have scored design wins from several popular notebook OEMs, which means the chips could have a good run at the markets this generation. Notebooks powered by the 9955HX3D and discrete GPU options that include the GeForce RTX 5090 Laptop GPU and the RTX 5070 Ti Laptop GPU, are expected to be priced around €2,530 and €3,860, respectively.

Intel has implemented substantial price cuts across its Xeon 6 "Granite Rapids" server processor lineup, marking a significant shift in its data center strategy. The reductions, quietly introduced and reflected in Intel's ARK database, come just four months after the processors' September launch. The most dramatic cut affects Intel's flagship 128-core Xeon 6980P, which saw its price drop from $17,800 by 30% to $12,460. This aggressive pricing positions the processor below AMD's competing EPYC "Turin" 9755 128-core CPU both absolute and per-core pricing, intensifying the rivalry between the two semiconductor giants. AMD's SKU at 128 cores is now pricier at $12,984, with higher core count SKUs reaching up to $14,813 for 192-core EPYC 9965 CPU based on Zen 5c core. Intel is expected to release 288-core "Sierra Forest" Xeon SKUs this quarter, so we can get an updated pricing structure and compare it to AMD.

Additionally, Intel's price adjustments extend beyond the flagship model, with three of the five Granite Rapids processors receiving substantial reductions. The 96-core Xeon 6972P and 6952P models have been marked down by 13% and 20% respectively. These cuts make Intel's offerings particularly attractive to cloud providers who prioritize core density and cost efficiency. However, Intel's competitive pricing comes with trade-offs. The higher power consumption of Intel's processors—exemplified by the 96-core Xeon 6972P's 500 W requirement, which exceeds AMD's comparable model by 100 W—could offset the initial savings through increased operational costs. Ultimately, most of the data center buildout will be won by whoever can serve the most CPU volume shipped (read wafer production capacity) and the best TCO/ROI balance, including power consumption and performance.

ASUS is working on a new line of NUC mini PCs powered by the AMD Ryzen AI MAX "Strix Halo" mobile processors that come with oversized iGPUs and CPU core counts as high as 16-core/32-thread "Zen 5." This was sniffed out in shipping manifests by Olrak29_ on its way to being tested by the BIS (Bureau of Indian Standards) for regulatory certification similar to CE, with the manifest describing the NUC model as the "NUC14LNS," meaning that this box is from the NUC 14 series. The manifest describes the NUC sample as featuring the top of the line Ryzen AI MAX+ 395.

The Ryzen AI MAX+ 395 maxes out everything on the silicon, featuring 16 "Zen 5" CPU cores across two CCDs with full 512-bit FPUs, with 80 MB of "total cache" (L3+L2) between them; a 50 TOPS-class NPU that can locally accelerate Microsoft Copilot+, and that large RDNA 3.5 iGPU with 40 compute units (2,560 stream processors), 80 AI accelerators, and 40 ray accelerators. What's interesting about this NUC is that it will not come with SO-DIMM slots, since the "Strix Halo" SoC features a 256-bit wide LPDDR5X memory interface. It will either have hardwired memory, or use a pair of LPCAMM2 modules (each with a 128-bit bus width), which is less likely. With all the rage about AI developers using M4-powered Mac minis to accelerate DeepSeek, is ASUS eying a slice of the AI market?

After several months of teasers, the Ayaneo 3 gaming handheld has finally witnessed its official launch. The product will be available with two APUs - the Ryzen 7 8840U for the entry variant, and the Ryzen AI 9 HX 370 for the high-end variant. The system can be equipped with up to 64 GB of LPDDR5X-7500 memory, and a whopping 4 TB of SSD storage. The handheld will also feature modular controllers, which can be detached with the click of a single button.

The Ayaneo 3 will also give customers the option to chose between an LCD or an OLED panel, and as VideoCardz notes, selecting the OLED option does not change the final price. As mentioned earlier, the system will be available with either a Zen 4 or a Zen 5 APU. The Strix Point variant leads the Hawk Point part by almost around 50% in multicore tests, and the HX 370's integrated Radeon 890M iGPU is somewhere around 25% more performant than the 8840U's Radeon 780M. Clearly, the performance gap between the two variants will be substantial.

AMD's Ryzen 9 9950X3D and Ryzen 9 9900X3D "Zen 5" processors are scheduled for launch around March time, with many a hardcore PC enthusiast salivating at the prospect of an increase in core counts over already released hardware—the ever popular Ryzen 7 9800X3D CPU makes do with eight cores (and sixteen threads). Under normal circumstances, higher core counts do not provide a massive advantage in gaming applications—over the years, Team Red's 8-core 3D V-Cache-equipped models have reigned supreme in this so-called "sweet spot." Many have wondered whether new-gen 12 and 16-core SKU siblings had any chance of stealing some gaming performance thunder—a recently published VideoGamer article provides a definitive answer for the "Granite Ridge" generation.

The publication managed to extract key quotes from Martijn Boonstra—a Team Red product and business development manager—providing a slightly tepid outlook for the incoming Ryzen 9 9950X3D and 9900X3D models. The company executive stated: "(our) new chips will provide similar overall gaming performance to the Ryzen 7 9800X3D. There will be some games that perform a bit better—if the game engine utilizes more cores and threads—and some games will perform a little worse (if the game engine favors a single CCD configuration), but on the whole, the experience is comparable." Boonstra did not reveal any details regarding forthcoming prices—the Ryzen 7 9800X3D has an MSRP of $479 (if you are lucky enough to find one)—but he hinted that finalized digits will be announced "closer to launch." He signed off with standard marketing spiel: "Ryzen 9000X3D Series desktop processors are perfect for gamers and content creators alike...whether you are already on the AM5 platform, on AM4 or another platform, these products are sure to impress."