AMD Ryzen 7 9800X3D will be available to purchase from today, November 7, 2024. The 8-core/16-thread processor features 3D V-Cache technology, and is based on the "Zen 5" microarchitecture. AMD has priced the 9800X3D at $480 (MSRP). The processor was reviewed by TechPowerUp yesterday, we conclude that it is the fastest processor for a gaming PC build, posting the highest frame-rates at any resolution. It is 12% faster than Intel's flagship Core Ultra 9 285K "Arrow Lake" processor at gaming (at 1080p), although the processor falls behind in productivity workloads due to its significantly lower CPU core count than other CPUs, such as the cheaper Core i7-14700K or Core Ultra 7 265K. The 9800X3D is only around 5% faster than its predecessor, the 7800X3D, at gaming, although it is 13% faster than the 5800X3D.

You can read all about the AMD Ryzen 7 9800X3D in its TechPowerUp Review.

We are days away from the official November 7 launch of AMD's Ryzen 7 9800X3D CPU with 3D V-Cache, and we are already seeing some estimates of the speedup compared to the last-generation Ryzen 7 7800X3D CPU. According to a Geekbench submission discovered by Everest (Olrak29_) on X, the upcoming AMD Ryzen 7 9800X3D has been spotted running at a clock speed of 5.46 GHz. This is a 260 MHz increase from the official boost frequency of 5.2 GHz, which indicates overclocking has been applied. If readers recall, the last generations of X3D processors had overclocking disabled, and this time, things are looking different thanks to the compute die being placed on top of SRAM. AMD attributes this to CCD being closer to the heat spreader instead of memory and allowing it to spread heat more effectively, ensuring a stable overclock.

Regarding performance, the Ryzen 7 9800X3D outperforms its predecessor, the Ryzen 7 7800X3D, by an impressive 27.4% in the single-core Geekbench v6 test and 26.8% in the multicore test. The last generation CPU scored 2,726 points in single-core and 15,157 points in multicore tests, while the new Zen 5 design has managed to produce 3,473 points in single-core and 19,216 in multicore tests. These results are approximately 27% improvement over the Zen 4, suggesting that the Zen 5 architecture benefits greatly from better SRAM bandwidth and capacity. While these results only come from synthetic benchmarks, they give us a picture of what to expect from this CPU. We have to wait for more real-world test cases to fully conclude the improvement factor.

MSI is thrilled to introduce the upcoming AMD Ryzen 7 9800X3D, an innovation built on the Zen 5 architecture and featuring AMD's groundbreaking 3D V-Cache technology. The Ryzen 7 9800X3D is designed for peak performance with improved IPC and superior power efficiency compared to the previous generation, promising an exhilarating leap in computing power.

The Ryzen 7 9800X3D integrates seamlessly with the AM5 socket ecosystem, providing users access to PCIe Gen 5 bandwidth and high-speed DDR5 memory support. Built on a 4 nm process, this processor establishes a new performance, power efficiency, and responsiveness benchmark, ideal for intensive gaming and content creation. MSI's X870(E) motherboards are fully compatible with the Ryzen 7 9800X3D, featuring a robust lineup from MEG X870E GODLIKE to MAG X870 TOMAHAWK WIFI. MSI's X870(E) motherboards and AMD's latest processors unlock peak gaming performance for users.

Today, AMD unveiled new desktop computing products, delivering enhanced performance for gamers. The lineup features the new AMD Ryzen 7 9800X3D Desktop processor, based on the "Zen 5" architecture and utilizing 2nd Gen AMD 3D V-Cache technology.

With the AMD Ryzen 7 9800X3D processor, AMD has re-engineered its cutting-edge on-chip memory solution with 2nd Gen AMD 3D V-Cache technology. The 64 MB cache memory has been relocated below the processor, which puts the core complex die (CCD) closer to the cooling solution to help keep the "Zen 5" cores cooler, delivering high clock rates and providing up to an average 8% gaming performance improvement compared to our last-gen generation and up to an average 20% faster than the competition. This revolutionary change in placement allows for extreme overclocking of the processor. It's the first X3D processor to be fully unlocked, empowering enthusiasts and gamers to push its performance to new limits.

AMD is about to launch the Ryzen 7 9800X3D 8-core/16-thread processor with 3D V-cache on November 7, 2024, and it is widely expected to extend AMD's leadership with gaming performance. Hoang Anh Phu, a reliable source with PC hardware leaks, says that the 9800X3D comes with a launch price that's $30 higher than the 7800X3D, which had launched at $450. This would put the 9800X3D at $480. At this price, the 9800X3D is priced $80 higher than the Core Ultra 7 265K, and exactly $100 less than the Core Ultra 9 285K. It would also launch about $40 higher than the current street price of the Core i9-14900K, and $120 higher than the Core i7-14700K. The 9800X3D is also a whopping $150 pricier than the Ryzen 7 9700X.

The Ryzen 7 7800X3D remains the fastest PC processor for gaming; neither Intel's limited-edition Core i9-14900KS nor the latest Core Ultra 9 285K could beat it. The 9800X3D has three things going for it—firstly, it's the new "Zen 5" microarchitecture and the IPC uplift that comes with it; secondly, it has a 500 MHz higher base frequencies, and 200 MHz higher maximum boost frequencies than the 7800X3D; and lastly, AMD has inverted the way it stacks the 3D V-cache die with the CPU complex die (CCD), with the CCD now stacking on top of the L3D, which is expected to give the 9800X3D thermal behavior similar to non-X3D processors such as the 9700X.Update 14:29 UTC: This is confirmed by AMD's official announcement, which just went live.

Specifications of the upcoming AMD Ryzen 7 9800X3D processor were leaked to the web by a Geizhals listing. The chip comes with a processor base frequency of 4.70 GHz, and a maximum boost frequency of 5.20 GHz. The base frequency of 4.70 GHz is a significant increase from the 4.20 GHz of the current 7800X3D, while the maximum boost frequency has moved up a couple of notches from the 5.05 GHz of the 7800X3D. The TDP of the processor is set at 120 W, same as the 7800X3D, and higher than the 105 W revised-spec cTDP of the non-X3D Ryzen 7 9700X.

The specs sheet also confirms that the 3D V-cache size is unchanged generationally. The stacked 3D V-cache die adds 64 MB to the on-die 32 MB L3 cache, which is exposed to software as a 96 MB contiguously addressable L3 cache. The per-core L2 cache size remains 1 MB per core. The biggest contributor to generational gaming performance increases will rest on the increase in frequencies, the new "Zen 5" microarchitecture and any IPC improvements on offer, plus L3 cache performance improvements AMD introduced with "Zen 5." We recently reported a spectacular theory that AMD has designed the 9800X3D such that the stacked 3D V-cache is positioned below the 8-core CPU complex die chiplet, and not above it, which should significantly improve thermals, and clock speeds.

Much of the Ryzen 7 9800X3D teaser material from AMD had the recurring buzzwords "X3D Reimagined," causing us to speculate what it could be. 9550pro, a reliable source with hardware leaks, says that AMD has redesigned the way the CPU complex die (CCD) and 3D V-cache die (L3D) are stacked together. In past generations of X3D processors, such as the 5800X3D "Vermeer-X" and the 7800X3D "Raphael-X," the L3D is stacked on top of the CCD. It would stack above the central region of the CCD that has the on-die 32 MB L3 cache, while blocks of structural silicon would be placed on top of the edges of the CCD that have the CPU cores, with these structural silicon blocks performing the crucial task of transferring heat from the CPU cores to the IHS above. This is about to change.

If the leaks are right, AMD has inverted the CCD-L3D stack with the 9000X3D series such that the "Zen 5" CCD is now on top, the L3D is below it, under the central region of the CCD. The CPU cores now dissipate heat to the IHS as they do on regular 9000 series processors without the 3D V-cache technology. The way we imagine they achieved this is by enlarging the L3D to align with the size of the CCD, and serve as a kind of "base tile." The L3D would have to be peppered with TSVs that connect the CCD to the fiberglass substrate below. We know where AMD is going with this in the future. Right now, the L3D "base tile" contains the 64 MB 3D V-cache that gets appended to the 32 MB on-die L3 cache, but in the future (probably with "Zen 6"), AMD could design the CCDs with TSVs even for the per-core L2 caches.

AMD's answer to Intel's "Lunar Lake" is here. According to Olrak29, who discovered a strange entry on the OpenBenchmark benchmarking suite made by Phoronix, we have preliminary information on AMD's "Krackan / Kraken Point" APU. Spotted in the benchmark trials is the "100-000000713" model, which corresponds to an eight-core, sixteen-threaded CPU with four regular Zen 5 and four smaller (but not less potent) Zen 5c cores clocked at 3.95 GHz. Do note that this is just an engineering sample in the wild, so final clock speeds will depend mainly on AMD and its OEMs, given by TDP they plan to support with Kraken Point.

Accompanying the 8C/16T CPU configuration is the 32 GB of LPDDR5X memory from SK Hynix. According to the benchmark reading, four 8 GB modules were present, so we expect it to be on the system board, unlike on-chip like Intel does with Lunar Lake. The memory is running at 8000 MT/s, which is a 500 MT/s improvement over Strix Point and slower than its competitor, Lunar Lake, which has LPDDR5X running at 8533 MT/s. Lastly, the Krackan / Kraken Point APU has been spotted with eight RDNA 3.5 Compute Units. Where this exactly lands in AMD's product stack is still unclear. We expect to hear more about it as we enter 2025, so by then, remain patient until the next leak.

Here is the first picture of the AMD Ryzen 7 9800X3D retail box up close. We've seen lower-res versions of this box in older leaks. A variation of the retail box-art of other Ryzen 9000 series "Granite Ridge" desktop processors, The 9800X3D box brightens up the silver background behind the AMD Arrow, as well as the Arrow's orange borders. One of the triangular background cutouts has the "7" brand extension, while the other mentions AMD 3D V-cache technology, which is all the confirmation we need that this indeed is the 9800X3D. AMD announced the 9000X3D series debut earlier this week, with product availability starting November 7, 2024.

The second generation of AMD Ryzen Z-series processors for handheld gaming consoles, will be led by the Ryzen Z2 Extreme. There will also be an affordable Ryzen Z2 (non-Extreme). We've known for some time that the Z2 Extreme is based on the 4 nm "Strix Point" monolithic silicon, with some optimization (the highest bins to facilitate the best energy efficiency); but now we have a few more details thanks to a leak by Golden Pig Upgrade. AMD's engineering effort with the Z2 Extreme will be to give the console the most generational performance uplift from the iGPU, rather than the CPU.

The "Strix Point" silicon features a significantly updated iGPU from the previous-generation "Phoenix." It's based on the more efficient RDNA 3.5 graphics architecture, which is better optimized for LPDDR5 memory; and comes with 16 compute units (CU), compared to 12 on the "Phoenix." The Ryzen Z2 Extreme will come with all 16 CU enabled. The CPU is where some interesting changes are planned. The "Strix Point" silicon features a dual-CCX CPU, one of these contains four "Zen 5" CPU cores sharing a 16 MB L3 cache, while the other features eight "Zen 5c" cores sharing an 8 MB L3 cache. For the Ryzen Z2 Extreme, AMD is going with an odd 3+5 core configuration. What this means is that the Ryzen Z2 Extreme will have 3 "Zen 5" cores, and 5 "Zen 5c" cores. The L3 cache on the CCX with "Zen 5" cores has been reduced to 8 MB in size. On paper, this is still an 8-core/16-thread CPU with 16 MB of L3 cache (same as "Phoenix,") but now you know that there's more going on.

AMD today lifted the covers off its Ryzen 7 9800X3D Socket AM5 processor powered by the "Zen 5" microarchitecture and 3D V-cache technology. The company did not put out any product specs or other details, except announcing November 7, 2024, as the product availability date for this chip. This would put its launch exactly two weeks from that of Intel's Core Ultra Series 2 "Arrow Lake-S" processors, and give reviewers time to include the performance results of the new Intel chips in reviews of the 9800X3D. AMD is looking to extend its gaming performance leadership which it held with the 7800X3D. The switch to the newer "Zen 5" microarchitecture and higher clock speeds could push gaming performance up beyond the 7800X3D by a few percentage points. The 7800X3D is already faster than the Core i9-14900K in gaming workloads, so we're being set up for an exciting clash between the Core Ultra 9 285K and the Ryzen 7 9800X3D for gaming performance.

Next up, AMD announced official price cuts for all four current models in its Ryzen 9000 "Granite Ridge" desktop processor family. Buyers in the retail channel should be able to find the flagship Ryzen 9 9950X 16-core/32-thread processor up to $50 cheaper than its launch price, which should bring it down to $600. The Ryzen 9 9900X (12-core/24-thread), the Ryzen 7 9700X (8-core/16-thread), and the Ryzen 5 9600X (6-core/12-thread), each get a haircut of up to $30. You should be able to find the 9900X for as little as $470. The 9700X should be down to as low as $330. The 9600X, the most affordable "Zen 5" part, should go for as low as $250. The price-cuts should be effective immediately. Although all pre-launch info points to this being an 9800X3D-only launch, our AMD PR contacts used the plural term ("X3D processors") when referring to the November 7 date. Could we see more than one X3D processor model launch, especially given the $50 price cut given to the 9950X? Watch this space.

AMD China has set up a press event to launch its new Ryzen 7 9800X3D "Zen 5" processor with 3D V-cache. The company is sending out invitations like the one pictured below to the Chinese tech press and select PC enthusiasts. The event is slated to take place in Zhuhai, and spans October 23 and 24, which could mean that the company has set up an experience zone, where visitors can take gaming desktops powered by the 9800X3D for a spin with popular game titles. It won't surprise us if AMD has at least an online press event planned around this time for the rest of the world.

The Ryzen 7 9800X3D is widely expected to extend AMD's lead with gaming performance. In first-party gaming benchmarks put out by Intel for its upcoming Core Ultra 9 285K "Arrow Lake" processor, the new chip is shown within 3% of the Core i9-14900K, which the current Ryzen 7 7800X3D beats, and the 9800X3D can only push the gaming performance envelope further from here. If it's not the higher IPC of "Zen 5," then it could be the alleged 5.20 GHz all-core boost frequency for the 9800X3D. The Ryzen 7 9800X3D is expected to go on sale in the first week of November 2024.

AMD has unveiled its latest EPYC processors, codenamed "Turin," featuring Zen 5 and Zen 5C dense cores. Phoronix's thorough testing reveals remarkable advancements in performance, efficiency, and value. The new lineup includes the EPYC 9575F (64-core), EPYC 9755 (128-core), and EPYC 9965 (192-core) models, all showing impressive capabilities across various server and HPC workloads. In benchmarks, a dual-socket configuration of the 128-core EPYC 9755 Turin outperformed Intel's dual Xeon "Granite Rapids" 6980P setup with MRDIMM-8800 by 40% in the geometric mean of all tests. Surprisingly, even a single EPYC 9755 or EPYC 9965 matched the dual Xeon 6980P in expanded tests with regular DDR5-6400. Within AMD's lineup, the EPYC 9755 showed a 1.55x performance increase over its predecessor, the 96-core EPYC 9654 "Genoa". The EPYC 9965 surpassed the dual EPYC 9754 "Bergamo" by 45%.

These gains come with improved efficiency. While power consumption increased moderately, performance improvements resulted in better overall efficiency. For example, the EPYC 9965 used 32% more power than the EPYC 9654 but delivered 1.55x the performance. Power consumption remains competitive: the EPYC 9965 averaged 275 Watts (peak 461 Watts), the EPYC 9755 averaged 324 Watts (peak 500 Watts), while Intel's Xeon 6980P averaged 322 Watts (peak 547 Watts). AMD's pricing strategy adds to the appeal. The 192-core model is priced at $14,813, compared to Intel's 128-core CPU at $17,800. This competitive pricing, combined with superior performance per dollar and watt, has resonated with hyperscalers. Estimates suggest 50-60% of hyperscale deployments now use AMD processors.

AMD Ryzen 7 9800X3D is rumored to launch sooner than expected, with the company targeting at least an announcement within October, with reviews and product availability within Q4 2024. The chip combines the latest "Zen 5" microarchitecture with 3D V-cache technology, and is expected to increase AMD's gaming performance outlook compared to the 7800X3D, which remains the fastest processor for gaming. An alleged screenshot of the processor grinding away at Cinebench surfaced, which reveals that the processor is capable of a 5.20 GHz all-core boost frequency, and comes with an impressive 4.70 GHz base frequency.

To put these clock speeds into perspective, the current Ryzen 7 9700X processor without the 3D V-cache, comes with a 3.80 GHz base and 5.50 GHz maximum boost frequency. This would be the first time that an X3D SKU is coming with a higher base frequency than a regular SKU. For example, the 7800X3D comes with a 4.20 GHz base frequency compared to the 4.50 GHz of the 7700X. Interestingly, the 5.20 GHz all-core boost frequency of the 9800X3D is on par with the all-core boost of the 9700X, which only hits 5.50 GHz boost on lightly threaded workloads. It remains to be seen what TDP and package power tracking (PPT) values AMD gives the 9800X3D, given that it had to retrofit the SKU with a 105 W cTDP mode via firmware, to eke out an up to 10% performance gain over the original specs.

MiTAC Computing Technology Corporation, an industry-leading server platform design manufacturer and a subsidiary of MiTAC Holdings Corporation (TSE:3706), today announced the launch of its new high-performance servers, featuring the latest AMD EPYC 9005 Series CPUs and AMD Instinct MI325X accelerators.

"AMD is the trusted data center solutions provider of choice for leading enterprises worldwide, whether they are enabling corporate AI initiatives, building large-scale cloud deployments, or hosting critical business applications on-premises," said Ravi Kuppuswamy, senior vice president, Server Business Unit, AMD. "Our latest 5th Gen AMD EPYC CPUs provide the performance, flexibility and reliability - with compatibility across the x86 data center ecosystem - to deliver tailored solutions that meet the diverse demands of the modern data center."

AMD (NASDAQ: AMD) today announced the availability of the 5th Gen AMD EPYC processors, formerly codenamed "Turin," the world's best server CPU for enterprise, AI and cloud. Using the "Zen 5" core architecture, compatible with the broadly deployed SP5 platform and offering a broad range of core counts spanning from 8 to 192, the AMD EPYC 9005 Series processors extend the record-breaking performance and energy efficiency of the previous generations with the top of stack 192 core CPU delivering up to 2.7X the performance compared to the competition.

New to the AMD EPYC 9005 Series CPUs is the 64 core AMD EPYC 9575F, tailor made for GPU powered AI solutions that need the ultimate in host CPU capabilities. Boosting up to 5 GHz, compared to the 3.8 GHz processor of the competition, it provides up to 28% faster processing needed to keep GPUs fed with data for demanding AI workloads.

Today, AMD (NASDAQ: AMD) announced its third generation commercial AI mobile processors, designed specifically to transform business productivity with Copilot+ features including live captioning and language translation in conference calls and advanced AI image generators. The new Ryzen AI PRO 300 Series processors deliver industry-leading AI compute, with up to three times the AI performance than the previous generation, and offer uncompromising performance for everyday workloads. Enabled with AMD PRO Technologies, the Ryzen AI PRO 300 Series processors offer world-class security and manageability features designed to streamline IT operations and ensure exceptional ROI for businesses.

Ryzen AI PRO 300 Series processors feature new AMD "Zen 5" architecture, delivering outstanding CPU performance, and are the world's best line up of commercial processors for Copilot+ enterprise PCs. Laptops equipped with Ryzen AI PRO 300 Series processors are designed to tackle business' toughest workloads, with the top-of-stack Ryzen AI 9 HX PRO 375 offering up to 40% higher performance and up to 14% faster productivity performance compared to Intel's Core Ultra 7 165U. With the addition of XDNA 2 architecture powering the integrated NPU, AMD Ryzen AI PRO 300 Series processors offer a cutting-edge 50+ NPU TOPS (Trillions of Operations Per Second) of AI processing power, exceeding Microsoft's Copilot+ AI PC requirements and delivering exceptional AI compute and productivity capabilities for the modern business. Built on a 4 nm process and with innovative power management, the new processors deliver extended battery life ideal for sustained performance and productivity on the go.

The Chinese tech press is abuzz with slides allegedly from Intel's pre-launch press-deck for the Core Ultra 2-series "Arrow Lake-S." The most sensational of these are Intel's first-party performance claims for the top Core Ultra 9 285K model. There's good news and bad news. Good news first—Intel claims to have made a big leap in energy efficiency with "Arrow Lake," and the 285K should offer gaming performance comparable to the current Core i9-14900K at around 80 W lower power draw for the processor. But then there in lies the bad news—despite claimed IPC gains for the "Lion Cove" P-core, and rumored clock speeds being on par with the "Raptor Cove" P-cores on the i9-14900K, the 285K is barely any faster than its predecessor in absolute terms.

In its first party testing, when averaged across 12 game tests, which we used Google optical translation to make out the titles of, Intel used performance numbers of the i9-14900K as the mean. The 285K beats the i9-14900K in only four games—Warhammer 40K: Space Marine 2, Age of Mythology Retold, Civilization VI: Gathering Storm, and F1 23. It's on-par with the i9-14900K in Red Dead Redemption 2, Total War: Pharaoh, Metro Exodus, Cyberpunk 2077, Black Myth: Wukong, Rainbow Six Siege. It's slower than the i9-14900K in Far Cry 6, FF XIV, F1 24, Red Dead Redemption 2. Averaged across this bench, the Core Ultra 9 285K ends up roughly on par with the Core i9-14900K in gaming. Intel also compared the 285K to AMD's Ryzen 9 9950X, and interestingly, even the Ryzen 9 7950X3D.

High-resolution die-shots of the AMD "Zen 5" 8-core CCD were released and annotated by Nemez, Fitzchens Fitz, and HighYieldYT. These provide a detailed view of how the silicon and its various components appear, particularly the new "Zen 5" CPU core with its 512-bit FPU. The "Granite Ridge" package looks similar to "Raphael," with up to two 8-core CPU complex dies (CCDs) depending on the processor model, and a centrally located client I/O die (cIOD). This cIOD is carried over from "Raphael," which minimizes product development costs for AMD at least for the uncore portion of the processor. The "Zen 5" CCD is built on the TSMC N4P (4 nm) foundry node.

The "Granite Ridge" package sees the up to two "Zen 5" CCDs snuck up closer to each other than the "Zen 4" CCDs on "Raphael." In the picture above, you can see the pad of the absent CCD behind the solder mask of the fiberglass substrate, close to the present CCD. The CCD contains 8 full-sized "Zen 5" CPU cores, each with 1 MB of L2 cache, and a centrally located 32 MB L3 cache that's shared among all eight cores. The only other components are an SMU (system management unit), and the Infinity Fabric over Package (IFoP) PHYs, which connect the CCD to the cIOD.

AMD today made four key announcements for its Ryzen 9000 series "Granite Ridge" desktop processors based on the "Zen 5" microarchitecture. These mainly aim to improve upon the products as originally launched in August. To begin with, AMD announced a 105 W cTDP (configurable TDP) mode for the Ryzen 7 9700X and Ryzen 7 9600X processors, with full warranty coverage. This setting can be enabled in the UEFI setup program of a motherboard running its latest version of UEFI firmware, which encapsulates the AGESA ComboAM5 PI 1.2.0.2 microcode. The setting raises the PPT (package power tracking) value of the 9700X and 9600X to 140 W, and treats them as if they were 105 W TDP processors. These chips were originally launched by AMD with 65 W (88 W PPT), and as reviewers quickly found out, unlocking power improves performance at stock clock speeds, as it improves boost frequency residence of these chips.

Next up, is the AGESA PI 1.2.0.2 microcode itself, which introduces the 105 W cTDP mode for the 9700X and 9600X along with warranty coverage, which we just talked about; plus works to improve the core-to-core latency on the Ryzen 9 9900X and Ryzen 9 9950X. These are processors with two CPU complex dies (CCDs), each with either 8 or 6 cores enabled. To the software, this is still a single-socket (1P) CPU with 12 or 16 cores. Although some awareness of the dual-CCD architecture is added to the OS scheduler to help it localize certain kinds of workloads (such as games) to a single CCD, reviewers noted that core-to-core latency on the dual-CCD chips was still too high, which should affect performance when a software's threads are migrating between cores, or if a workload is multithreaded, such as media encoding. AMD addressed exactly this with the new AGESA PI 1.2.0.2 update.

We've known about the upcoming AMD Ryzen 7 9800X3D for a good long while now, and previous leaks and rumors indicated that it would offer a rather significant boost in gaming performance thanks to changes to the 3D V-cache amounts and layouts. Now, a new leak, which purports to show off the official retail packaging for the new CPU, suggests that clock speeds will get a boost over the existing AMD Ryzen 7 78000X3D.

The leak, shared by Moore's Law Is Dead on YouTube, shows off a supposed retail box for the AMD Ryzen 7 9800X3D that was sent to AMD's partners for marketing, and along with that, he claims to have had access to the entire marketing slide deck, which is where the frequency boost information comes from. According to the leaker, the 9800X3D's marketing material specifically calls out the processor as being "designed for increased frequencies."

Major AMD partners like ASUS, ASRock, GIGABYTE, and MSI have unveiled their latest AMD AM5 motherboards featuring the X870E and X870 chipsets. The new motherboards offer broad compatibility, supporting not only the latest AMD Ryzen 9000 series, but also the Ryzen 8000 and 7000 CPUs. These boards are aimed at high-end and enthusiast users, sporting optimized VRM designs and enhanced I/O capabilities, including WiFi 7 and USB 4 support.

The motherboards are all in ATX format; however, mATX/ITX models should follow later this year. They all support DDR5-5600 MT/s memory speeds natively, with some models supporting over 8000 MT/s memory speeds. In terms of chipset, the X870E series uses two Promontory 21 dies with support for USB 4 and Gen 5 GPU/SSD (24x Gen 5 CPU Lanes, 8x Gen 4 + 12x Gen 3 PCH Lanes). The X870 will use just one of the dies, retaining the Gen 5 lanes, however the PCH Lanes will be limited to 4x Gen 4 + 8x Gen 3.

NZXT, a leader in PC gaming components, gear, and prebuilt gaming systems, is excited to announce the N9 X870E ATX motherboard, optimized for the new "Zen 5" architecture based AMD Ryzen 9000 series desktop processors. NZXT's latest motherboard combines high-performance features with a stunning new look that is geared towards enthusiast PC gamers building a high-end AMD system.

The N9 X870E boasts overclocking-ready power delivery and optimized thermals, providing gamers with the tools and headroom to overclock their AMD Ryzen 9000, 8000 or 7000 series processors and memory to their highest levels of performance. Additionally, the N9 X870E ensures prolonged compatibility with future and previous generations of Ryzen processors, thanks to AMD's commitment to support the AM5 platform until 2027+.

BIOSTAR, a leading manufacturer of motherboards, graphics cards, IPC solutions, and storage devices, today is excited to unveil the shiny new X870E VALKYRIE flagship motherboard designed to run the latest "Zen 5" architecture based AMD Ryzen 9000 series processors. Built on BIOSTAR's top-of-the-line VALKYRIE platform, the X870E VALKYRIE delivers exceptional features and functionality, catering to gamers, content creators, and PC enthusiasts alike.

Meticulously crafted to cater to the modern-day professional, the X870E VALKYRIE motherboard offers unparalleled power and stability across the most demanding applications. Whether you're designing immersive 3D worlds, rendering high-definition animations, editing ultra-high-resolution videos, or pushing the limits of AAA gaming, this motherboard is engineered to deliver. Powered by the latest AMD Ryzen 9000 series processors built on "Zen 5" architecture, with support for up to 192 GB of DDR5 memory and PCIe 5.0 technology, the X870E VALKYRIE ensures seamless, high-speed performance for even the most intensive tasks, including generative AI computing. With support for AMD EXPO & Intel XMP technologies, it can extract the maximum capability out of all hardware to deliver the best user experience.

Earlier this week, we got rumors that AMD is rushing in the Ryzen 7 9800X3D 8-core/16-thread "Zen 5" processor with 3D V-cache for a late-October debut. The 9800X3D succeeds the popular 7800X3D, and AMD probably hopes it will have a competitive gaming processor in time for Intel's Core Ultra 2-series "Arrow Lake-S" launch. In the previous article, it was reported that the higher core-count 9000X3D series processor models, the Ryzen 9 9950X3D and Ryzen 9 9900X3D, would arrive some time in Q1 2025, because it was reported that the chips have certain "new features" compared to their predecessors, the 7950X3D and 7900X3D. At the time, we even explored the possibility of AMD giving both 8-core CCDs on the processor 3D V-cache. Turns out, this is where things are headed.

A new report by Benchlife.info claims that the higher core-count 9950X3D and 9900X3D will implement 3D V-cache on both CCD chiplets, giving these processors an impressive 192 MB of L3 cache (96 MB per CCD), and 208 MB or 204 MB of "total cache" (L2+L3). The report also says that AMD is planning a Ryzen 5 9600X3D chip, its second attempt at taking on Intel's Core i5 lineup, following its very recent release of the Ryzen 5 7600X3D, which ended up 1-3% short of the Core i5-14600K in gaming workloads. There's no word on whether the 9600X3D will launch in October alongside the 9800X3D, or in Q1-2025 with the Ryzen 9 9000X3D series.