Recent engineering samples of AMD's upcoming Ryzen 9 9950X3D reveal what appear to be the finalized specifications of the top-tier AM5 chip. The 16-core, 32-thread processor builds upon the gaming success of the Ryzen 7 9800X3D while addressing its core count limitations. The flagship processor features AMD's refined cache design, combining 96 MB of 3D V-Cache with 32 MB of standard L3 cache. Unlike its predecessor, the 7950X3D, the new Zen 5 architecture incorporates a redesigned CCD stacking method. The CCD now sits above the cache, directly interfacing with the STIM and IHS, eliminating thermal constraints that previously required frequency limitations. The processor features asymmetric cache distribution across its dual CCDs—one die combines 32 MB of base L3 cache with a 64 MB stacked V-Cache layer, while its companion die utilizes a standard 32 MB L3 cache configuration. In total, there is a 128 MB of L3 cache, with 16 MB of L2.

This architectural advancement enables the 9950X3D to achieve a 5.65 GHz boost clock across both CCDs, matching non-X3D variants. The processor maintains a 170 W TDP, suggesting improved thermal efficiency despite the additional cache. AMD's software-based OS scheduler will continue to optimize gaming workloads by directing them to the CCD with 3D V-Cache. Early leaks indicate the 9950X3D matches the base 9950X in Cinebench R23 scores, both in single and multi-threaded tests—a significant improvement over the 7950X3D, which lagged behind its non-X3D counterpart due to frequency limitations. AMD plans to expand the Zen 5 X3D lineup in Q1-2025 with both the 9950X3D and 9900X3D models. Full performance benchmarks and pricing details are expected at CES 2025, where AMD will officially unveil these processors alongside their RDNA 4 GPUs.

AMD fans are undoubtedly on their toes to witness the performance improvements that Strix Halo is ready to bring forth. Unlike Strix Point, which utilizes a combination of Zen 5c and full-fat Zen 5 cores, Strix Halo will do away with the small cores for a Zen 5 "only" setup, allowing for substantially better multicore performance. Moreover, it is also widely expected that Strix Halo will boast chunky iGPUs that will bring the heat to entry-level and even some mid-range mobile GPUs, allowing Strix Halo systems to not require discrete graphics at all, with a prime example being the upcoming ROG Flow Z13 tablet.

As per recent reports, the upcoming Ryzen AI Max+ Pro 395 APU will sport an RDNA 3.5-based iGPU with a whopping 40 CUs, and will likely be branded as the Radeon 8060S. In a leaked Geekbench Vulkan benchmark, the Radeon 8060S managed to outpace the RTX 4060 Laptop dGPU in performance. However, according to yet another leaked benchmark, Passmark, the Radeon 8060S and the 32-CU 8050S scored 16,454 and 16,663 respectively - and no, that is not a typo. The 8060S with 40 CUs is marginally slower than the 8050S with 32 CUs, clearly indicating that the numbers are far from final. That said, performance in this range puts the Strix Halo APUs well below the RTX 4070 laptop GPU, and roughly the same as the RTX 3080 Laptop. Not bad for an iGPU, although it is almost certain that actual performance of the retail units will be higher, judging by the abnormally small delta between the 8050S and the 8060S.

AMD's client computing division is expected to have an action-packed 2025 International CES. On the CPU front, the company is expected to expand its Ryzen 9000X3D family with high-core count models, such as the Ryzen 9 9950X3D and Ryzen 9 9900X3D. It is also expected to introduce certain power-efficient 65 W models of its non-X3D Ryzen 9000 series "Zen 5" chips, which serve as value options within this processor generation, to try and lure buyers off the 65 W Intel Core Ultra "Arrow Lake-S" models. On the gaming graphics side, the company is expected to debut its Radeon RX 9000 series, led by the RX 9070 XT and RX 9070, both of which are based on the "Navi 48" silicon, and powered by the RDNA 4 graphics architecture.

That's not all, AMD is also expected to announce the new FSR 4 technology for gamers. Leaks describe FSR 4 as being a performance enhancement that's a generation ahead of FSR 3.x. While FSR 3.x combines super-resolution based performance enhancement, and algorithmic frame-generation that nearly doubles framerates; FSR 4 is expected to be AMD's first performance enhancement to incorporate AI to not just enhance the visual detail in super-resolution, but also to improve accuracy of frame-generation. At this point, it is not known if FSR 4 will be available as a feature at launch of the Radeon RX 9070 series. VideoCardz reports that the early-January announcements could be followed by late-January availability of the hardware.

The AMD Ryzen 7 9800X3D launched this November remains the fastest processor for PC gaming, but with just an 8-core/16-thread configuration, its performance in multithreaded productivity pales in comparison to the alternatives, including from AMD's own camp, such as the Ryzen 9 7950X3D. The company is planning to expand the Zen 5 X3D line of desktop processors in Q1-2025, with the introduction of its high core-count Ryzen 9 series SKUs, the Ryzen 9 9950X3D, and the Ryzen 9 9900X3D. HXL, a reliable source with hardware leaks, says that the Ryzen 9 X3D SKUs will lack the kind of "frequency debuff" we've seen with the older generation Ryzen 9 X3D chips such as the 7950X3D and 7900X3D.

On the 7950X3D, only one of the two 8-core CCDs comes with 3D V-Cache, the other is a regular CCD with 32 MB on-die L3 cache. The CCD with the 3D V-Cache has its frequency "debuffed" compared to the other CCD, mainly to deal with the thermal limitations of the way the 3D V-Cache is stacked on top of the CCD. With the Ryzen 9000 X3D generation, AMD has redesigned this CCD + L3D stacking such that the CCD is now above, directly interfacing with the STIM and IHS; with no conductive structural silicon along the way. This means that the CCD now thermally behaves like a regular Zen 5 CCD; and for this reason, not only will the CCD with 3D V-Cache on the 9950X3D/9900X3D have the same clock speeds and boosting behavior as the one without 3D V-Cache; but also the 9950X3D and 9900X3D are expected to ship with similar, if not identical clock speeds to the 9950X and 9900X.

Last week, we reported on a massive leak that gave us a glimpse at a surfeit of upcoming ROG gaming laptops from ASUS boasting Arrow Lake-HX and Strix Halo processors, along with RTX 50-series Laptop GPUs. The company has now gone ahead and officially teased its ROG Flow Z13 laptop and the ROG Strix 18 laptop, the videos for which were obtained by VideoCardz. Considering that these were just teasers, the details shared were sparse, but undoubtedly intriguing regardless.

The ROG Strix 18, will likely boast the Core Ultra 9 285HX and Core Ultra 9 275HX CPUs along with NVIDIA "Blackwell" Laptop GPUs, with up to an 175-watt RTX 5090 Laptop with 16 GB of GDDR7 VRAM. Multiple other GPU options will also be available, with the RTX 5070 Ti Laptop GPU being the entry-point as per the leaked listings. Clearly, the Strix 18 is poised to be a powerful and power-hungry desktop replacement-class laptop, along with a massive 18-inch mini LED screen with a speedy 240 Hz refresh rate. Needless to say, the G18 has no intention of being affordable.

OneXPlayer has pulled back the veil on its G1 gaming notebook, and the product sure does look intriguing. Calling it a notebook might not even be fair, considering that its 8.8-inch display barely exceeds tablet territory. However, for lovers of compact gaming systems and handhelds, the G1 looks like it ticks many boxes, and its detachable keyboard is undoubtedly a welcome addition.

The system is powered by AMD's 12-core Ryzen AI 9 HX 370 "Strix Point" APU with 4 Zen 5 and 8 Zen 5c cores, along with a powerful Radeon 890M iGPU with 16 CUs based on the RDNA 3.5 architecture. The aforementioned 8.8-inch display is quite the looker as well, featuring a 2.5K resolution with a speedy 144 Hz refresh rate. At least on paper, it appears that the OneXPlayer G1 leaves very little room for complaint.

GEEKOM, a Taiwanese tech company famous for making high quality mini PCs, is heading to CES for the second consecutive year in 2025 with an exciting lineup of new products. Known as the Green Mini PC Global Leader, GEEKOM always focuses on improving the quality and reliability of its products, and it also spares no effort in cutting down carbon emissions and making the world a greener place.

Among the many mini PCs that GEEKOM plans to put on show at CES 2025, there are many industry firsts. The GEEKOM QS1, for instance, is the world's first mini PC powered by a Qualcomm chipset. The tiny computer sports an Arm-based Qualcomm Snapdragon X1E-80-100 processor with twelve 4.0 GHz Oryon CPU cores, a 3.8 TFLOPS Adreno X1-85 GPU and a 45 TOPS Hexagon NPU. It is smart and fast enough to breeze through all of your daily home and office computing chores, yet energy-efficient enough to significantly cut down your electric bill.

Ever since AMD introduced Strix Point, enthusiasts like ourselves have been eagerly awaiting details regarding the high-end Strix Halo APUs with integrated graphics that are rumored to be powerful enough for the system to not require discrete graphics at all. Leaks regarding the upcoming performance mobile APU lineup have been trickling out steadily, and a fresh new Geekbench leak reveals the CPU performance of the Ryzen AI+ Max 395 APU, which boasts a 16-core configuration consisting entirely of Zen 5 cores, unlike Strix Point which features a mix of Zen 5 and the smaller Zen 5c cores. And oh dear, are the numbers ever so lucrative.The APU managed to rake in 2,849 points in the single-core department, and a whopping 20,708 points in multicore. As Videocardz correctly notes, this result is far ahead of AMD's current top-end mobile offering, the Ryzen 9 7945HX3D, which manages around 16,900 points in the multicore test. In single-core, however, the Ryzen 9 7945HX3D does edge ahead, with around 2,900 points. That said, the ROG Flow Z13 laptop that the APU was housed in is most likely still in the testing phase, so it is entirely possible that the final product will sport even better performance. That being said, the Apple M4 Max SoC, however, remains in a league of its own with 3,800 points in single-core and a shocking 25,000 points in multicore. With CES 2025 just around the corner, it's only a matter of weeks before the Ryzen AI Max+ lineup finally sees the light of day and reaches our hands.

CES 2025 is less than a month away and leaks about AMD Strix Halo APUs are starting to emerge. Today we have confirmation via a leaked Geekbench Vulcan test that AMD will launch the Ryzen AI MAX+ PRO 395 w/ Radeon 8060S "Strix Halo" APU. Information reveals that this APU is equipped with 16 Zen 5 cores with 32 threads, a 3 GHz base frequency (4.4 GHz max), and a boost up to 5.1 GHz. It sports a 32 MB L3 cache per CCD for a total of 64 MB since it uses a dual CCD chip design. The TDP should be between 55-130 W. Moreover, the "PRO" in the product naming suggests that AMD could release non-PRO models at a later date.

The integrated Radeon 8060S iGPU adopts the RDNA 3.5 architecture with 40 computing units and was tested using an AMD reference board design codenamed AMD MAPLE-STXH and 64 GB of memory scoring 67,004 points in the Geekbench Vulkan test. This initial result is lower than AMD Radeon RX 7600 RDNA 3 discrete entry-level products (despite having more cores 40CU vs 32CU), and higher than NVIDIA GeForce RTX 3050. However, since the benchmark was run on an evaluation platform without optimized drivers and more likely using an early test sample product, we can expect the actual performance of the Radeon 8060S iGPU to be higher.

About a month ago, we reported about the AMD Ryzen 7 9800X3D "Zen 5" processor with 3D V-Cache that is flying off the shelves, with scalpers trying to make a profit from buying the retail inventory. The processor continues to face widespread availability issues more than a month after its launch, though the company assures consumers that relief is on the horizon. "We are working diligently to get as much supply to market as possible, with more processors being shipped every week," an AMD spokesperson told Tom's Hardware. "We expect availability to get better as shipments ramp throughout the quarter." The CPU is not only hard to find but also proves to be one of the most sought-after processors on Amazon.

The supply shortage has created opportunities for scalpers, who are listing the processor at prices reaching $1,000—more than double its retail price. Even established retailers like Walmart have listed the chip at inflated prices, approaching $800. Adding to consumers' challenges, some third-party sellers have posted fraudulent listings, making it crucial for buyers to verify seller credibility. While major retailers like Amazon, Newegg, Best Buy, and B&H Photo maintain the official $479 price point when in stock, securing a unit at this price has proven challenging for most consumers. As the holiday season is here, AMD's promised production ramp-up is much needed, as gamers have been planning their upgrade months in advance and are in dire need of pushing the performance of their systems up another notch.

AMD has silently disabled the loop buffer feature in its Zen 4 processor architecture through an AGESA microcode update. This development, first reported by the website Chips and Cheese, affects the entire Ryzen 7000 series processors and related EPYC models. The loop buffer, a power-optimization feature capable of storing 144 entries (72 per thread with SMT enabled), was implemented for the first time in AMD's Zen 4 architecture but has been notably absent from the newer Zen 5 design. The feature's primary function was to allow the processor's front end to power down while maintaining operational efficiency. The change was discovered when testing an ASRock B650 PG Lightning motherboard paired with a Ryzen 9 7950X3D processor. Hardware performance monitoring showed the loop buffer was active in BIOS version 1.21 (AGESA 1.0.0.6) but ceased to function after updating to BIOS 3.10 with AGESA 1.2.0.2a.

In a performance test conducted by Chips and Cheese, we learned that there is no significant impact from the feature's deactivation, suggesting the existing op cache provides sufficient bandwidth for optimal processor operation. AMD's architectural design has historically relied on its op cache for similar functionality. The feature appeared experimental, given the lack of documentation and the absence of programming guides for loop buffer optimization. Unlike competitors Intel and Arm, who have extensively documented their loop buffer implementations, AMD's approach appeared less developed. While the exact reasoning behind the deactivation remains unclear, disabling undocumented features is a step in the right direction, mainly as future Zen architecture iteration doesn't rely on a loop buffer, as seen with Zen 5.

AYANEO has officially revealed its latest handheld gaming console, dubbed the AYANEO 3. The company has teased the handheld multiple times in the past, while refraining from sharing any specifications regarding the same. Now, however, the company has detailed the internals for its new flagship handheld along with a few extra details.

The AYANEO 3 appears to be powered exclusively by AMD APUs, with Intel's Lunar Lake options nowhere to be found. Interested buyers will get to choose between either the Ryzen AI 9 HX 370 "Strix Point" APU, or the Ryzen 7 8840U "Hawk Point" APU. The "Strix Point" option happens to be AMD's latest and greatest, packing 4 Zen 5 and 8 Zen 5c cores, while the "Hawk Point" option sports 8 Zen 4 cores only.

AMD Ryzen AI MAX 300-series processors, codenamed "Strix Halo," have been on in the news for close to a year now. These mobile processors combine "Zen 5" CPU cores with an oversized iGPU that offers performance rivaling discrete GPUs, with the idea behind these chips being to rival the Apple M3 Pro and M3 Max processors powering MacBook Pros. The "Strix Halo" mobile processor is an MCM that combines one or two "Zen 5" CCDs (some ones featured on "Granite Ridge" desktop processors and "Turin" server processors), with a large SoC die. This die is built either on the 5 nm (TSMC N5) or 4 nm (TSMC N4P) node. It packs a large iGPU based on the RDNA 3.5 graphics architecture, with 40 compute units (CU), and a 50 TOPS-class XDNA 2 NPU carried over from "Strix Point." The memory interface is a 256-bit wide LPDDR5X-8000 for sufficient memory bandwidth for the up to 16 "Zen 5" CPU cores, the 50 TOPS NPU, and the large 40 CU iGPU.

Golden Pig Upgrade leaked what looks like a company slide from a notebook OEM, which reveals the iGPU model names for the various Ryzen AI MAX 300-series SKUs. Leading the pack is the Ryzen AI MAX+ 395. This is a maxed out SKU with a 16-core/32-thread "Zen 5" CPU that uses two CCDs. All 16 cores are full-sized "Zen 5." The CPU has 64 MB of L3 cache (32 MB per CCD), each of the 16 cores has 1 MB of dedicated L2 cache. The iGPU is branded Radeon 8060S, it comes with all 40 CU (2,560 stream processors) enabled, besides 80 AI accelerators, and 40 Ray accelerators. The Ryzen AI MAX 390 is the next processor SKU, it comes with a 12-core/24-thread "Zen 5" CPU. Like the 395, the 390 is a dual-CCD processor, all 12 cores are full-sized "Zen 5." There's 64 MB of L3 cache, and 1 MB of L2 cache per core. The Radeon 8060S graphics solution is the same as the one on the Ryzen AI MAX+ 395, it comes with all 40 CU enabled.

Unlike the Ryzen 7 9700X, which was off to a glacial start when it launched, the new Ryzen 7 9800X3D "Zen 5" processor with 3D V-Cache is flying off the shelves. This is the fastest gaming processor you can buy, and gamers want their best machines in place when the next generation of GPUs make landfall starting January 2025. As of this writing, the 9800X3D is out of stock on Newegg, Amazon, and Micro Center. The chip is, however, available through systems integrators and OEMs, who probably secured their inventory of the chip separately. A quick look over at eBay suggests that the 9800X3D is being scalped—the practice where individuals buy up inventory of the processor at retail prices, and re-sell it at a mark-up. We are seeing prices in the range of $670 to $800. There are probably limits to how high scalpers can price the 9800X3D, because at a high enough price, buyers could simply not be interested in the chip, and simply pick up a much cheaper 7800X3D, or the versatile 7950X3D, or even go Intel with the i9-14900K.

AMD Ryzen 7 9800X3D will be available to purchase from today, November 7, 2024. The 8-core/16-thread processor features 3D V-Cache technology, and is based on the "Zen 5" microarchitecture. AMD has priced the 9800X3D at $480 (MSRP). The processor was reviewed by TechPowerUp yesterday, we conclude that it is the fastest processor for a gaming PC build, posting the highest frame-rates at any resolution. It is 12% faster than Intel's flagship Core Ultra 9 285K "Arrow Lake" processor at gaming (at 1080p), although the processor falls behind in productivity workloads due to its significantly lower CPU core count than other CPUs, such as the cheaper Core i7-14700K or Core Ultra 7 265K. The 9800X3D is only around 5% faster than its predecessor, the 7800X3D, at gaming, although it is 13% faster than the 5800X3D.

You can read all about the AMD Ryzen 7 9800X3D in its TechPowerUp Review.

We are days away from the official November 7 launch of AMD's Ryzen 7 9800X3D CPU with 3D V-Cache, and we are already seeing some estimates of the speedup compared to the last-generation Ryzen 7 7800X3D CPU. According to a Geekbench submission discovered by Everest (Olrak29_) on X, the upcoming AMD Ryzen 7 9800X3D has been spotted running at a clock speed of 5.46 GHz. This is a 260 MHz increase from the official boost frequency of 5.2 GHz, which indicates overclocking has been applied. If readers recall, the last generations of X3D processors had overclocking disabled, and this time, things are looking different thanks to the compute die being placed on top of SRAM. AMD attributes this to CCD being closer to the heat spreader instead of memory and allowing it to spread heat more effectively, ensuring a stable overclock.

Regarding performance, the Ryzen 7 9800X3D outperforms its predecessor, the Ryzen 7 7800X3D, by an impressive 27.4% in the single-core Geekbench v6 test and 26.8% in the multicore test. The last generation CPU scored 2,726 points in single-core and 15,157 points in multicore tests, while the new Zen 5 design has managed to produce 3,473 points in single-core and 19,216 in multicore tests. These results are approximately 27% improvement over the Zen 4, suggesting that the Zen 5 architecture benefits greatly from better SRAM bandwidth and capacity. While these results only come from synthetic benchmarks, they give us a picture of what to expect from this CPU. We have to wait for more real-world test cases to fully conclude the improvement factor.

MSI is thrilled to introduce the upcoming AMD Ryzen 7 9800X3D, an innovation built on the Zen 5 architecture and featuring AMD's groundbreaking 3D V-Cache technology. The Ryzen 7 9800X3D is designed for peak performance with improved IPC and superior power efficiency compared to the previous generation, promising an exhilarating leap in computing power.

The Ryzen 7 9800X3D integrates seamlessly with the AM5 socket ecosystem, providing users access to PCIe Gen 5 bandwidth and high-speed DDR5 memory support. Built on a 4 nm process, this processor establishes a new performance, power efficiency, and responsiveness benchmark, ideal for intensive gaming and content creation. MSI's X870(E) motherboards are fully compatible with the Ryzen 7 9800X3D, featuring a robust lineup from MEG X870E GODLIKE to MAG X870 TOMAHAWK WIFI. MSI's X870(E) motherboards and AMD's latest processors unlock peak gaming performance for users.

Today, AMD unveiled new desktop computing products, delivering enhanced performance for gamers. The lineup features the new AMD Ryzen 7 9800X3D Desktop processor, based on the "Zen 5" architecture and utilizing 2nd Gen AMD 3D V-Cache technology.

With the AMD Ryzen 7 9800X3D processor, AMD has re-engineered its cutting-edge on-chip memory solution with 2nd Gen AMD 3D V-Cache technology. The 64 MB cache memory has been relocated below the processor, which puts the core complex die (CCD) closer to the cooling solution to help keep the "Zen 5" cores cooler, delivering high clock rates and providing up to an average 8% gaming performance improvement compared to our last-gen generation and up to an average 20% faster than the competition. This revolutionary change in placement allows for extreme overclocking of the processor. It's the first X3D processor to be fully unlocked, empowering enthusiasts and gamers to push its performance to new limits.

AMD is about to launch the Ryzen 7 9800X3D 8-core/16-thread processor with 3D V-cache on November 7, 2024, and it is widely expected to extend AMD's leadership with gaming performance. Hoang Anh Phu, a reliable source with PC hardware leaks, says that the 9800X3D comes with a launch price that's $30 higher than the 7800X3D, which had launched at $450. This would put the 9800X3D at $480. At this price, the 9800X3D is priced $80 higher than the Core Ultra 7 265K, and exactly $100 less than the Core Ultra 9 285K. It would also launch about $40 higher than the current street price of the Core i9-14900K, and $120 higher than the Core i7-14700K. The 9800X3D is also a whopping $150 pricier than the Ryzen 7 9700X.

The Ryzen 7 7800X3D remains the fastest PC processor for gaming; neither Intel's limited-edition Core i9-14900KS nor the latest Core Ultra 9 285K could beat it. The 9800X3D has three things going for it—firstly, it's the new "Zen 5" microarchitecture and the IPC uplift that comes with it; secondly, it has a 500 MHz higher base frequencies, and 200 MHz higher maximum boost frequencies than the 7800X3D; and lastly, AMD has inverted the way it stacks the 3D V-cache die with the CPU complex die (CCD), with the CCD now stacking on top of the L3D, which is expected to give the 9800X3D thermal behavior similar to non-X3D processors such as the 9700X.Update 14:29 UTC: This is confirmed by AMD's official announcement, which just went live.

Specifications of the upcoming AMD Ryzen 7 9800X3D processor were leaked to the web by a Geizhals listing. The chip comes with a processor base frequency of 4.70 GHz, and a maximum boost frequency of 5.20 GHz. The base frequency of 4.70 GHz is a significant increase from the 4.20 GHz of the current 7800X3D, while the maximum boost frequency has moved up a couple of notches from the 5.05 GHz of the 7800X3D. The TDP of the processor is set at 120 W, same as the 7800X3D, and higher than the 105 W revised-spec cTDP of the non-X3D Ryzen 7 9700X.

The specs sheet also confirms that the 3D V-cache size is unchanged generationally. The stacked 3D V-cache die adds 64 MB to the on-die 32 MB L3 cache, which is exposed to software as a 96 MB contiguously addressable L3 cache. The per-core L2 cache size remains 1 MB per core. The biggest contributor to generational gaming performance increases will rest on the increase in frequencies, the new "Zen 5" microarchitecture and any IPC improvements on offer, plus L3 cache performance improvements AMD introduced with "Zen 5." We recently reported a spectacular theory that AMD has designed the 9800X3D such that the stacked 3D V-cache is positioned below the 8-core CPU complex die chiplet, and not above it, which should significantly improve thermals, and clock speeds.

Much of the Ryzen 7 9800X3D teaser material from AMD had the recurring buzzwords "X3D Reimagined," causing us to speculate what it could be. 9550pro, a reliable source with hardware leaks, says that AMD has redesigned the way the CPU complex die (CCD) and 3D V-cache die (L3D) are stacked together. In past generations of X3D processors, such as the 5800X3D "Vermeer-X" and the 7800X3D "Raphael-X," the L3D is stacked on top of the CCD. It would stack above the central region of the CCD that has the on-die 32 MB L3 cache, while blocks of structural silicon would be placed on top of the edges of the CCD that have the CPU cores, with these structural silicon blocks performing the crucial task of transferring heat from the CPU cores to the IHS above. This is about to change.

If the leaks are right, AMD has inverted the CCD-L3D stack with the 9000X3D series such that the "Zen 5" CCD is now on top, the L3D is below it, under the central region of the CCD. The CPU cores now dissipate heat to the IHS as they do on regular 9000 series processors without the 3D V-cache technology. The way we imagine they achieved this is by enlarging the L3D to align with the size of the CCD, and serve as a kind of "base tile." The L3D would have to be peppered with TSVs that connect the CCD to the fiberglass substrate below. We know where AMD is going with this in the future. Right now, the L3D "base tile" contains the 64 MB 3D V-cache that gets appended to the 32 MB on-die L3 cache, but in the future (probably with "Zen 6"), AMD could design the CCDs with TSVs even for the per-core L2 caches.

AMD's answer to Intel's "Lunar Lake" is here. According to Olrak29, who discovered a strange entry on the OpenBenchmark benchmarking suite made by Phoronix, we have preliminary information on AMD's "Krackan / Kraken Point" APU. Spotted in the benchmark trials is the "100-000000713" model, which corresponds to an eight-core, sixteen-threaded CPU with four regular Zen 5 and four smaller (but not less potent) Zen 5c cores clocked at 3.95 GHz. Do note that this is just an engineering sample in the wild, so final clock speeds will depend mainly on AMD and its OEMs, given by TDP they plan to support with Kraken Point.

Accompanying the 8C/16T CPU configuration is the 32 GB of LPDDR5X memory from SK Hynix. According to the benchmark reading, four 8 GB modules were present, so we expect it to be on the system board, unlike on-chip like Intel does with Lunar Lake. The memory is running at 8000 MT/s, which is a 500 MT/s improvement over Strix Point and slower than its competitor, Lunar Lake, which has LPDDR5X running at 8533 MT/s. Lastly, the Krackan / Kraken Point APU has been spotted with eight RDNA 3.5 Compute Units. Where this exactly lands in AMD's product stack is still unclear. We expect to hear more about it as we enter 2025, so by then, remain patient until the next leak.

Here is the first picture of the AMD Ryzen 7 9800X3D retail box up close. We've seen lower-res versions of this box in older leaks. A variation of the retail box-art of other Ryzen 9000 series "Granite Ridge" desktop processors, The 9800X3D box brightens up the silver background behind the AMD Arrow, as well as the Arrow's orange borders. One of the triangular background cutouts has the "7" brand extension, while the other mentions AMD 3D V-cache technology, which is all the confirmation we need that this indeed is the 9800X3D. AMD announced the 9000X3D series debut earlier this week, with product availability starting November 7, 2024.

The second generation of AMD Ryzen Z-series processors for handheld gaming consoles, will be led by the Ryzen Z2 Extreme. There will also be an affordable Ryzen Z2 (non-Extreme). We've known for some time that the Z2 Extreme is based on the 4 nm "Strix Point" monolithic silicon, with some optimization (the highest bins to facilitate the best energy efficiency); but now we have a few more details thanks to a leak by Golden Pig Upgrade. AMD's engineering effort with the Z2 Extreme will be to give the console the most generational performance uplift from the iGPU, rather than the CPU.

The "Strix Point" silicon features a significantly updated iGPU from the previous-generation "Phoenix." It's based on the more efficient RDNA 3.5 graphics architecture, which is better optimized for LPDDR5 memory; and comes with 16 compute units (CU), compared to 12 on the "Phoenix." The Ryzen Z2 Extreme will come with all 16 CU enabled. The CPU is where some interesting changes are planned. The "Strix Point" silicon features a dual-CCX CPU, one of these contains four "Zen 5" CPU cores sharing a 16 MB L3 cache, while the other features eight "Zen 5c" cores sharing an 8 MB L3 cache. For the Ryzen Z2 Extreme, AMD is going with an odd 3+5 core configuration. What this means is that the Ryzen Z2 Extreme will have 3 "Zen 5" cores, and 5 "Zen 5c" cores. The L3 cache on the CCX with "Zen 5" cores has been reduced to 8 MB in size. On paper, this is still an 8-core/16-thread CPU with 16 MB of L3 cache (same as "Phoenix,") but now you know that there's more going on.

AMD today lifted the covers off its Ryzen 7 9800X3D Socket AM5 processor powered by the "Zen 5" microarchitecture and 3D V-cache technology. The company did not put out any product specs or other details, except announcing November 7, 2024, as the product availability date for this chip. This would put its launch exactly two weeks from that of Intel's Core Ultra Series 2 "Arrow Lake-S" processors, and give reviewers time to include the performance results of the new Intel chips in reviews of the 9800X3D. AMD is looking to extend its gaming performance leadership which it held with the 7800X3D. The switch to the newer "Zen 5" microarchitecture and higher clock speeds could push gaming performance up beyond the 7800X3D by a few percentage points. The 7800X3D is already faster than the Core i9-14900K in gaming workloads, so we're being set up for an exciting clash between the Core Ultra 9 285K and the Ryzen 7 9800X3D for gaming performance.

Next up, AMD announced official price cuts for all four current models in its Ryzen 9000 "Granite Ridge" desktop processor family. Buyers in the retail channel should be able to find the flagship Ryzen 9 9950X 16-core/32-thread processor up to $50 cheaper than its launch price, which should bring it down to $600. The Ryzen 9 9900X (12-core/24-thread), the Ryzen 7 9700X (8-core/16-thread), and the Ryzen 5 9600X (6-core/12-thread), each get a haircut of up to $30. You should be able to find the 9900X for as little as $470. The 9700X should be down to as low as $330. The 9600X, the most affordable "Zen 5" part, should go for as low as $250. The price-cuts should be effective immediately. Although all pre-launch info points to this being an 9800X3D-only launch, our AMD PR contacts used the plural term ("X3D processors") when referring to the November 7 date. Could we see more than one X3D processor model launch, especially given the $50 price cut given to the 9950X? Watch this space.